LaserBlaze: Application features and process

The laser processing machine Blaze is a compact, high-precision machine for drilling and cutting of glass. By using a 3-axis galvo scanner, the machine is ideal for 3D machining. The use of a high-performance nano-second laser with an output of up to 100 W allows for high-precision material removal.

Typical applications

• Drilling and cutting of glass and ceramic

• Micro structuring, processing of precision components

• Cutting and drilling of electronic components, eg Wafers

• Micro-Drilling

Process quality

Through the use of nanosecond laser technology, a high material removal can be achieved on almost any material. A laser power of 100 W allows economic machining with short turn-around times.

Automatic process control

The machine is equipped with sensors for component thickness compensation. Autofocus correction per automatic Z-axis compensation. Laser power meter allow for a compensation of laser energy. Accuracy can be increased significantly through the use of 3-axis scanner system; Z-axis compensation in scanner field with scanner speed is possible.

Registration

The workstation have a high resolution CCD camera with LED ring lighting. Automatic corrections of offset, rotation, shrinking and stretching are possible.

Options

Nanosekundenlaser mit unterschiedlicher Leistung und Wellenlänge (50W, 532 nm)

Materials

Glass, Ceramic, Metal and Plastics