Solutions for laser processing of flexible electronic components

In many areas of printed circuit board manufacturing, laser cutting and drilling tools are already de-facto standard. Separation of Flex connecters are just one of the many benefits from this technology.

In this context, the nanosecond UV laser is the tool of choice. This technology is highly productive and flexible even when manufacturing small batch sizes. Largely due to the Carbon free material removal, in conjunction with a kerf of only 20 microns, it is possible, to cut for example, flex connectors in high dimensional accuracy at the same geometry with excellent quality.

Another advantage of UV lasers is the ability to cut and structure such metals as copper. The introduction of cavities by high accuracy targeted ablation is also possible.

Based on proven machine concepts, Schmolls UV laser choice, with unique maximum repetition rate and efficiency while cutting flexible circuit boards, demonstrates the top quality of the selection of components used. Particularly the exclusive use of 3-axis Galvo to ensure a high frequency service, both in XY and Z.

Designed exclusively for the application. The control software makes it possible to take advantage of all of the components used.